Research Associate

FULL TIME RESEARCH ASSOCIATE

New York University Tandon School of Engineering

The Research in Advanced Integrated Systems and Circuits (RAISE) Lab at the Electrical and Computer Engineering (ECE) department at NYU Tandon School of Engineering is seeking to hire a Full time Research Associate to work on joint communication and sensing integrated solutions at mmWave frequency ranges.

New York University (NYU) is one of the top private universities in the United States, and the Tandon School of Engineering, located in Brooklyn, NY, is deeply committed to excellence in teaching and learning. Tandon fosters student and faculty innovation and entrepreneurship that make a difference in the world. The ECE department at Tandon, with a track record of pioneering advanced research in wireless technology, is dedicated to the advancement of future integrated solutions for a variety of communication and sensing applications. In particular, the RAISE lab's mission under the supervision of Prof. Hamed Rahmani is to research advanced electronics, applied Electromagnetic and integration technologies to further advance this vision.

Expectations

Candidates will be responsible for driving an independent research project to address the signal generation and transmission at the mmWave/THz range. The successful candidate will have a demonstrated background RF/Analog circuit, microwave components, and physics, as exemplified by a strong publication record. Previous experience on _transistor-level design, high-frequency electromagnetic simulation, and Electronic Design Automation (EDA) tools is desired.

Salary range

In compliance with NYC's Pay Transparency Act, the annual base salary for this position is $48,000, annually, depending on the candidate's experience and qualification.

Expected start date and period of employment

Expected start date is: September 16th, 2024. This position is expected to be for 4 months, ending on January 15th, 2025.

Candidates should have at least a MS in Electrical and Computer Engineering or a related field. Candidates will be required to present eligibility to work in the United States.

Applicants should submit the following information:

+ Cover letter

+ up-to-date CV that includes a complete list of publications,

+ names and contact information for three references.

+ Other additional information needed (e.g., research statement, publications)

All application materials should be submitted electronically via Interfolio and to: hamedrahmani@nyu.edu

Review of applications will begin as soon as possible and will continue until the position is filled.

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